Solder delivery systems
US4712721A · kind A · utility
57Cited by
28References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1986 |
| Grant date | Dec 15, 1987 |
| Priority date | — |
| Expiry date | Mar 17, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0726
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.