Patent · US Expired

Method for bonding an insulated wire element on a contact

US4712723A · kind A · utility

9Cited by

13References

12Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Helmut Moll · Irvine, US
Gerd Wiegel · Langenzenn, DE
Josef Schindler · Regensburg, DE
Wilfried Scherer · Heidenheim, DE
Kurt Marth · Heidenheim, DE

Key dates

Filing date	Apr 14, 1986
Grant date	Dec 15, 1987
Priority date	—
Expiry date	Apr 14, 2006

Classification

Technology area (CPC H)Electricity
CPC primaryH01R43/0207
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A method for bonding a lacquer insulated wire to a metallic support is disclosed. The method is carried out in two steps: First, the wire is exposed to ultrasonic energy so that the lacquer is broken up and the wire is deformed in a certain area and welded to the support. Then the entire area of deformation is enclosed with a thixotropic adhesive. In preferred embodiments, the method is used for bonding the winding wire of a HF-inductor coil with contact elements shaped as wires or lugs.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.