Process for reducing the distortion of multi-layered laminates
US4713202A · kind A · utility
2Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1985 |
| Grant date | Dec 15, 1987 |
| Priority date | — |
| Expiry date | May 6, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2509/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for preparing a multilayer structure. The structure is produced at an elevated temperature. The structure is characterized in that it distorts upon changes in temperature; includes at least two layers of different materials, at least one of which creeps significantly at the elevated temperature at which the structure is prepared and; contains no layers which creep significantly at ambient temperature. The process includes cooling said structure such that at least one of the layer(s) which creeps at said elevated temperature is cooled at a rate which is least 50% less than the material cooling rate thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.