Method for distributing wire load in a multilayer package and the resulting product
US4713773A · kind A · utility
16Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1984 |
| Grant date | Dec 15, 1987 |
| Priority date | — |
| Expiry date | Aug 10, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for distributing wire load among the layers of a multilayer interconnection package such that in each region of the package, the wire load is balanced among all layers and such that specified subsets of two-pin connections may be constrained to lie within the same layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.