Electrophoretic insulation of metal circuit board core
US4714646A · kind A · utility
10Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1987 |
| Grant date | Dec 22, 1987 |
| Priority date | — |
| Expiry date | Jun 17, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit with an internal metal sheet for heat dissipation has a roughened aluminum sheet with via holes coated with acrylic or epoxy resin containing thixotropic fumed silicon dioxide or silicate clay. The resin and thixotropic agent are electrophoretically coated. The thixotropic agent may act both to even the coating around edges and as a material upon which metal plating of the printed circuit is bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.