Metallizable substrate composites and printed circuits produced therefrom
US4714653A · kind A · utility
3Cited by
19References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 1987 |
| Grant date | Dec 22, 1987 |
| Priority date | — |
| Expiry date | Feb 2, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Substrate composites, well adopted for the production of metallized printed circuits and facilely prepared by, e.g., papermaking procedures, include a central core layer comprising fibrous cellulosic material or flaked mica within a matrix of a thermosetting resin binder, said central core element having coextensively laminated to at least one of the face surfaces thereof, a lamina of a thermosetting resin comprising non-conductive metal oxide filler material distributed therethrough, and said metal oxide being borohydride reduceable and reactive to form unstable metal hydride intermediates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.