Pressure-sensitive adhesive containing heat-sensitive materials, and method of making the same
US4714655A · kind A · utility
42Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1985 |
| Grant date | Dec 22, 1987 |
| Priority date | — |
| Expiry date | Oct 4, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2891
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A heat-sensitive material is incorporated into a fluid prepolymer precursor of a pressure-sensitive adhesive to form a stable mixture. The mixture is cast onto a substrate, and the prepolymer is polymerized into a pressure-sensitive adhesive by the action of ultraviolet radiation, electron-beam radiation, or a combination thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.