Tape automated manufacture of power semiconductor devices
US4716124A · kind A · utility
26Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1986 |
| Grant date | Dec 29, 1987 |
| Priority date | — |
| Expiry date | Aug 20, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a main current lead. The manufacturing process permits thorough electrical testing of a power semiconductor chip prior to incorporation into a relatively expensive power device package. In particular, the power chip can be tested at full-rated current, at least where the current is pulsed at a low duty cycle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.