Solderless connector technique and apparatus
US4717345A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1986 |
| Grant date | Jan 5, 1988 |
| Priority date | — |
| Expiry date | Aug 19, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/365
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solderless connector technique and apparatus is presented for establishing electrical contact between a flexible circuit and another circuit device utilizing relative motion therebetween to wipe away or remove any debris or other foreign matter present on the terminals which could adversely effect electrical contact. In a first embodiment of the present invention, relative motion between the respective circuit devices is provided by male and female housings having a camming device incorporated therein. This camming device will effectively wipe away any foreign matter or debris located on the respective terminal devices. In another embodiment of the present invention, mechanical springs are used to provide lateral motion to the circuit devices thereby wiping away any dirt, dust or debris. Preferably, a means for prewiping i.e., a cleaning pad, is provided to the present invention to facilitate removal of debris.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.