Process for the treatment of copper oxide in the preparation of printed circuit boards
US4717439A · kind A · utility
17Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1985 |
| Grant date | Jan 5, 1988 |
| Priority date | — |
| Expiry date | Oct 24, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composition and process is disclosed for improving the leach resistance of the copper oxide coating on the copper circuitry of printed circuit boards to solutions used in their preparation which comprises contacting the copper oxide of the circuit board with a solution containing an amphoteric element which forms an acidic oxide, such as selenium dioxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.