Apparatus for aligning wires to solder pads
US4718164A · kind A · utility
3Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1986 |
| Grant date | Jan 12, 1988 |
| Priority date | — |
| Expiry date | Oct 15, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wire guide device includes a base fixture to which a microelectronic component is fixedly attached such that solder pads on the component are exposed. A lacette consisting of a plurality of spaced, upstanding posts is positioned adjacent the microelectronic component such that the posts are aligned with the solder pads. Fine wire is directed around the posts over the solder pads to a wire guide. The wire guide holds each laced wire in position for soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.