Substrates for electronic devices
US4720419A · kind A · utility
4Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 1986 |
| Grant date | Jan 19, 1988 |
| Priority date | — |
| Expiry date | Jan 17, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate for use in the manufacture of electronic devices, comprising a lamina made of an aluminum-bearing ferritic steel coated with an adherent layer of a material having a high dielectric strength, a low dielectric constant and a co-efficient of thermal expansion approximately equal to that of the steel lamina.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.