Heat sink assembly for a circuit board mounted integrated circuit
US4720771A · kind A · utility
8Cited by
15References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 2, 1987 |
| Grant date | Jan 19, 1988 |
| Priority date | — |
| Expiry date | Mar 2, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly including a lower heat sink and an upper heat sink which allows for affixation of a semiconductor to a circuit board with automatic soldering equipment and also provides the lower heat sink and upper heat sink sandwiching the semiconductor therebetween for firm, cushioned connection during assembly and for dissipating heat during semiconductor operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.