Method for forming thick film circuit using rotatable nozzle having wide discharge hole
US4720914A · kind A · utility
4Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1986 |
| Grant date | Jan 26, 1988 |
| Priority date | — |
| Expiry date | Mar 10, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to method and apparatus for forming a thick film circuit by discharging a thick film paste from a paste discharging hole of a drawing nozzle and drawing a desired pattern on a substrate. The paste discharging hole has a substantially wide configuration and the drawing nozzle is rotated about its axis of rotation so that the longitudinal direction of the elongated cross-section of the paste discharging hole is substantially normal to the direction in which the drawing nozzle is moved with respect to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.