Lead frame for semiconductor devices
US4721994A · kind A · utility
25Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1986 |
| Grant date | Jan 26, 1988 |
| Priority date | — |
| Expiry date | Jun 12, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention provides a semiconductor device lead frame comprising a mounting tab for a semiconductor chip located within the lead frame and multiple inner leads extending to the area adjacent to the perimeter of the tab. The configuration of the inner leads with respect to one another and the mounting tab is stabilized by adhering at least a portion of the leads and, optionally, the mounting tab to a dielectric film coated on one side with a cured, heat-activated silicone adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.