Solder connector device
US4722471A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1987 |
| Grant date | Feb 2, 1988 |
| Priority date | — |
| Expiry date | Jul 13, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S174/08
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention relates to heat-shrinkable devices for forming solder connections between two bodies such as electrical conductors or pipes. The devices each comprise a hollow, heat-shrinkable sleeve having at least one aperture and containing first and second solder inserts. The solder inserts are located adjacent to each other and the second insert responds to heat applied to the device more slowly than the first insert. Usually the second insert has a higher melting point than the first insert. When the device is installed the first solder insert melts but is prevented from flowing out of the aperture in the device by the second insert. Also flow of the fused first solder insert onto the second solder insert causes the second insert to melt with less heat being applied to the device than would be needed if only the second, higher melting point solder insert were present in the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.