Patent · US Expired

Process for preparing printed circuits

US4722765A · kind A · utility

82Cited by

7References

16Claims

0Family size

Assignee

Preh, Elektrofeinmechanische Werke Jakob Preh, Nachf. GmbH & Co. · DE

Inventors

Peter Ambros · Leutershausen, DE
Walter Budig · Stadtilm, DE
Gisela Westermeir · Bad Neustadt an der Saale, DE

Key dates

Filing date	Dec 23, 1986
Grant date	Feb 2, 1988
Priority date	—
Expiry date	Dec 23, 2006

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12903
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present invention describes an improved reverse lamination process for reparing printed circuits with resistors, conductor strips and/or contacts integrated in the circuit. A separating layer is applied on a metallic intermediate carrier. The intermediate carrier thus coated is then printed with a conductive paste in a desired. mirror-inverted layout to provide the resistors, conductor strips and/or contacts. This is followed by the lamination which is carried out under temperature effect and under pressure, the thus laminated package comprising the intermediate carrier, an intermediate layer and the final substrate. The intermediate carrier is subsequently removed, and the separating layer is etched off. The separating layer acts as a parting agent to permit easy mechanical separation and reuse of the metallic intermediate carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.