Signal transfer circuit for use in laminated multilayer electric circuit
US4723082A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1986 |
| Grant date | Feb 2, 1988 |
| Priority date | — |
| Expiry date | Jul 14, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K19/018557
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A laminated multilayer electric circuit is comprised of wafers having each internal electric circuits and laminated one after another. A signal transfer circuit used in the laminated multilayer electric circuit for transfer of signals between the wafers through an electrostatic capacitor has a receiving circuit of sufficiently high input resistance for receiving a signal from a capacitance electrode forming the electrostatic capacitor, and a circuit for clamping the level of the signal substantially within the input amplitude for the receiving circuit. The signal transfer circuit permits the signal transfer to be performed not through a flip-flop or the like and consequently at high speeds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.