Method for making porous bottom-layer dielectric composite structure
US4724021A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1986 |
| Grant date | Feb 9, 1988 |
| Priority date | — |
| Expiry date | Jul 23, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0195
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for inhibiting the formation of blisters during the firing of intermediate layers of fired multilayer electronic components comprising the sequential steps of: PA0 (1) applying to a substrate a first and second layer of finely divided particles of dielectric solids and glass dispersed in organic medium; and PA0 (2) firing the layers to effect volatilization of the organic medium therefrom, liquid phase sintering of the glass components and densification of both layers, the softening point of the glass, the particle size of the glass and the ratio of glass to dielectric solids in both layers being adjusted in such manner that when the layers are fired, the first layer is porous and the second layer is nonporous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.