Thin film circuit substrate
US4724182A · kind A · utility
15Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1986 |
| Grant date | Feb 9, 1988 |
| Priority date | — |
| Expiry date | Nov 25, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a thin film circuit substrate which comprises an electrically insulating substrate, and at least one conductor layer and one protecting layer which are formed on the substrate, the insulating substrate having a surface roughness which is equal to or smaller than 0.1 .mu.Ra when measured as a center line average height. The thin film circuit substrate is suitable for use, for example, in a thermal head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.