Wafer processing chuck using slanted clamping pins
US4724621A · kind A · utility
74Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1986 |
| Grant date | Feb 16, 1988 |
| Priority date | — |
| Expiry date | Apr 17, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer is introduced into a processing chamber on a transport device. Lifting pins receive the wafer from the transport device and lower the wafer to the surface of a chuck. Clamping pins lower and hold the wafer by means of enlargements on the ends of the clamping pins. Grooves on the surface of the chuck and internal channels in the chuck are used to supply gas to the back of the wafer for temperature control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.