Wafer processing cassette
US4724963A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 1986 |
| Grant date | Feb 16, 1988 |
| Priority date | — |
| Expiry date | Sep 29, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67326
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Wafer processing cassette for the processing of silicon wafers, which includes a plurality of open, reinforced, dual cross-section profiled wafer dividers for structural integrity and for supporting a plurality of wafers in alignment in opposing mirror image dividers of the cassette for automated robotic processing of the wafers while in the cassette. The cassette utilizes a cross-bar end with a configured rod reinforced open cross-bar, which is fully functional and strategically located for structural integrity. The dividers are supported by two pairs of longitudinal horizontal supports secured to ends providing for a multi-level, flow-through, open area between each of the dual profile geometrically configured dividers for ease of entry and passage of liquids during automated processing. Rapid fluid flow and drying of the cassette is effected using extra smooth cassette surfaces, rounded edges, filled corners, drain recesses, drain scuppers, and ramped surfaces. The rear area includes a downward arch. The processing wafer cassette provides for on-center processing where the carrier center of gravity is on-center of the axis of centrifugal wafer processing machinery. Each of the d…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.