Semiconductor power module

US4727454A · kind A · utility

Assignee

• Brown, Boveri & Cie AG · DE

Inventors

• Arno Neidig · Plankstadt, DE
• Klaus Bunk · Ahlhorn, DE
• Jens Gobrecht · Wustrow, DE

Key dates

• Filing date: Jun 4, 1987
• Grant date: Feb 23, 1988
• Expiry date: Jun 4, 2007

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module. The heat conduit includes a condensation area having a larger surface than the base surface, over which dissipation heat from the semiconductor power component is distributed.