Semiconductor power module with an integrated heat pipe

US4727455A · kind A · utility

Assignee

• Brown, Boveri & Cie AG · DE

Inventors

• Arno Neidig · Plankstadt, DE
• Hans G. Wessjohann · Mannheim, DE

Key dates

• Filing date: Feb 14, 1986
• Grant date: Feb 23, 1988
• Expiry date: Feb 14, 2006

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1301
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A semiconductor power module includes a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent the ceramic plate at the opening, a heat pipe integrated in the semiconductor power module having a vapor space, a condensation zone and a heating zone for distributing heat removed from the semiconductor power component at the heating zone over an area of the condensation zone being larger than the given area, a highly heat-conducting ceramic base plate having two metallized sides, and a frame vacuum-tightly interconnecting the carrier plate and the base plate forming the vapor space of the heat pipe therebetween.