Multi-wafer slicing with a fixed abrasive
US4727852A · kind A · utility
28Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1985 |
| Grant date | Mar 1, 1988 |
| Priority date | — |
| Expiry date | Aug 5, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.