Impact-resistant thermoplastic molding compounds based on polyphenylene ethers, polyoctenylenes and polyamides
US4728693A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1986 |
| Grant date | Mar 1, 1988 |
| Priority date | — |
| Expiry date | May 22, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L65/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition, which comprises (a) from 5 to 85 parts by weight of a melted or remelted preliminary molding compound consisting of from 60 to 98 parts by weight of polyphenylene ethers, 40 to 2 parts by weight of polyoctylenes, from 0.1 to 5 parts by weight of maleic anhydride and from 0.1 to 5 parts by weight of a further acid derivative which has a melting point below 100.degree. C. and which is selected from the group consisting of an unsaturated mono- or dicarboxylic acid having up to 14 carbon atoms, an anhydride thereof, which excludes maleic anhydride, and an ester of mono- or dicarboxylic acid with an alcohol of up to 6 carbon atoms; and (b) from 95 to 15 parts by weight of an aliphatic homopolyamide or a copolyamide containing a preponderant amount of aliphatic monomer units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.