Cooling system for electronic circuit device
US4729060A · kind A · utility
75Cited by
7References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1985 |
| Grant date | Mar 1, 1988 |
| Priority date | — |
| Expiry date | Jan 25, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.