Anisotropically conductive adhesive composition
US4729809A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1987 |
| Grant date | Mar 8, 1988 |
| Priority date | — |
| Expiry date | Feb 17, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An anisotropically conductive adhesive composition (10) for use in electrically connecting at least one conductive area (14) on one substrate (12) with at least one conductive area (20) on a second substrate (18) is disclosed. The composition (10) is comprised of a mixture of conductive particles and a nonconductive adhesive binder (26). The conductive particles are dispersed throughout the binder in a plurality of noncontiguous conductive units (24) such that, upon applying a layer (30) of the composition (10) over both the conductive and insulating areas (14, 16) on one substrate (12) and positioning in a conducting relationship and adhering said at least one conductive area (20) on the second substrate (18) with said at least one conductive area (14) on the first substrate (12), the units (24) establish electrical connection between the adhered conductive areas (14, 20) on the two substrates (12, 18). The units (24) are sufficiently spaced apart, however, to preclude electrical conductivity between adjacent areas on the same substrate. A method for electrically connecting conductive areas on two substrates by means of said anisotropically conductive adhesive composition (10) and…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.