Semiconductor power module with ceramic substrate
US4731644A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1986 |
| Grant date | Mar 15, 1988 |
| Priority date | — |
| Expiry date | Jun 16, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor power module includes a plastic housing, a ceramic substrate with upper and lower surfaces being disposed in the housing, upper and lower metallizations respectively disposed on the upper and lower surfaces of the substrate, components disposed on the upper metallization, at least one support having upper and lower parts and being disposed on the substrate in the housing, a first elastomeric soft casting compound disposed in the housing covering the substrate and the lower part of the at least one support, the upper part of the at least one support protruding from the first casting compound, and a second thermo-setting hard casting compound covering the upper part of the at least one support and connecting the upper part to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.