Polyamide resin containing free amino groups produced from polymeric fatty acid
US4732966A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 11, 1986 |
| Grant date | Mar 22, 1988 |
| Priority date | — |
| Expiry date | Feb 11, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyamides containing free amino groups and suitable for use as curing agents for polyepoxy compounds are derived from (a) a polybasic acid component comprising polymeric fatty acid together with from 10 to 90 mole %, based on the total acid component, of one or more aromatic dicarboxylic acids containing two carboxylic acid groups and one benzene ring, each carboxylic acid group being directly linked to a benzene ring, and (b) a polyamine component containing at least 50 mole % of one or more aliphatic polyamines containing at least three amino groups per molecule. Cured resinous composition may be prepared by reacting the polyamides with polyepoxy compounds and curable composition contain the polyamides together with polyepoxy compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.