Patent · US Expired

Process and apparatus for multiple lap cutting of solid materials

US4733649A · kind A · utility

1Cited by

4References

8Claims

0Family size

Assignee

Heliotronic Forschungs- und Entwicklungsgesellschaft fur Solarzellen-Grundstoffe mbH · DE

Inventors

Dieter Regler · Burghausen, DE
Alfred Moritz · Burghausen, DE
Klemens Muhlbauer · Altötting, DE

Key dates

Filing date	Mar 8, 1985
Grant date	Mar 29, 1988
Priority date	—
Expiry date	Mar 8, 2005

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/0058
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A process and an apparatus for carrying out a process for multiple lap cutting of solid materials, especially those having rectangular or square cross sections, in which the workpiece is subjected, during the cutting operation, to a rotating motion thereby improving the quality of the discs and increasing the cutting efficiency.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.