Enamellings with heterogeneous structure
US4734316A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1986 |
| Grant date | Mar 29, 1988 |
| Priority date | — |
| Expiry date | Jul 15, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An article of manufacture useful as the base for an electronic circuit board is a substrate with an enamel layer having a heterogeneous structure containing at least two different phases obtained by applying a homogeneous, alkali-containing enamel powder to the substrate followed by heating at 850.degree. C. to 1,000.degree. C. wherein the enamel power has the composition as follows: ______________________________________ Si.sub.O2 40-50% by weight Al.sub.2 O.sub.3 8-15% by weight Na.sub.2 O + K.sub.2 O 4-16% by weight CaO + BaO 25-35% by weight MgO 0-3% by weight B.sub.2 O.sub.3 0-10% by weight. ______________________________________
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.