Method of supporting and/or conveying a plate with fluid without physical contact
US4735449A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 24, 1986 |
| Grant date | Apr 5, 1988 |
| Priority date | — |
| Expiry date | Apr 24, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved method and apparatus are presented for supporting and/or conveying a plate by means of flow of fluid without physical contact. By providing a flat surface extending perpendicularly from the opening of a fluid delivery pipe and providing a suction pipe around the flat surface, static pressure of fluid becomes negative at the gap between the flat surface and a plate near the flat surface, to support and/or convey the plate beneath the flat surface without physical contact. The fluid delivered into the gap between the flat surface and plate is inhaled into the suction pipe and recirculated, to prevent the disturbance of the surrounding atmosphere by the fluid, the attachment of dust onto the plate and the introduction of dust into the fluid. This method is effective for handling of plates, such as semi-conductor wafers and magnetic discs, which should not be marred or stained by physical contact with a hand or a gripper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.