Housing for vibration sensitive circuits
US4736069A · kind A · utility
3Cited by
5References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1986 |
| Grant date | Apr 5, 1988 |
| Priority date | — |
| Expiry date | Sep 30, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S174/35
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an improved housing being comprised of a substrate and a cover that is plated to provide RF shielding. The substrate and cover are constructed of a like material to keep the coefficients of vibration approximately identical. Preferably, the substrate and cover material are ceramic thereby providing a rigid structure that minimizes vibration degradation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.