Method for diffusion bonding of liquid phase sintered materials
US4736883A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1987 |
| Grant date | Apr 12, 1988 |
| Priority date | — |
| Expiry date | Feb 25, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/302
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is disclosed for bonding liquid phase sintered metal powder parts of a tungsten alloy containing nickel. The method involves placing a sheet of copper based material between the parts at their adjoining surfaces to join the parts with the sheet covering essentially the entire area of the surfaces, heating the resulting assembly at a temperature sufficient to melt the copper based material without melting the parts, cooling the resulting heated assembly to room temperature, reheating the assembly at a temperature which is high enough to cause diffusion of the copper based material and the matrix alloying elements into one another without melting the parts, and cooling the resulting twice heated assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.