Printed wiring board for mounting electronic parts and process for producing the same
US4737395A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1985 |
| Grant date | Apr 12, 1988 |
| Priority date | — |
| Expiry date | Jul 12, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a metal sheet bonded to the area around the opening end on the rear of the board through an adhesive layer. The inside wall and bottom face of the opening in the board are coated with an integral plating film as are the rear surfaces of the board and metal sheet. According to this board structure, the heat generated from electronic parts mounted on the bottom of the opening is dispersed by the metal sheet, and also penetration of moisture into the opening through the plastic material and the adhesive layer, as occurs with conventional boards, is prevented by the plating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.