Thermoplastic resin composition containing wood flour
US4737532A · kind A · utility
79Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1986 |
| Grant date | Apr 12, 1988 |
| Priority date | — |
| Expiry date | Sep 9, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L97/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition comprising (A) 5 to 90 parts of a vinyl chloride polymer, (B) 90 to 50 parts of an ABS resin and (C) 70 to 5 parts of wood flour, the total amount of the component (A), (B) and (C) being 100 parts. The composition has functions and appearance peculiar to wood, excellent moldability and secondary processability and extremely improved heat distortion resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.