Silica filler for epoxy encapsulants and epoxy encapsulants containing same
US4738892A · kind A · utility
7Cited by
2References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 1985 |
| Grant date | Apr 19, 1988 |
| Priority date | — |
| Expiry date | Sep 27, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2995
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided an improved silica filler for resins which silica filler is coated or reacted with an alkoxyepoxyterpene silane. The resins containing such filler are characterized by improved dielectric constant and dissipation factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.