Hot-melt adhesive
US4738998A · kind A · utility
16Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1987 |
| Grant date | Apr 19, 1988 |
| Priority date | — |
| Expiry date | May 21, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Thermal insulating articles are disclosed of the type which comprises a laminate of thermal insulation and a flexible jacket material with the jacket and thermal insulation being directly adhesively adhered to each other by means of a hot-melt adhesive. The hot-melt adhesive employed consists essentially of an asphalt, an ethylene-vinyl acetate copolymer and a wax. Also provided is a hot-melt adhesive which consists essentially of an asphalt, an ethylene-vinyl acetate copolymer and a compatible wax, which is especially useful in adhering paper used as package wrap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.