Epoxy fortifiers based on aromatic polyhydroxyl compounds
US4739028A · kind A · utility
4Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1987 |
| Grant date | Apr 19, 1988 |
| Priority date | — |
| Expiry date | Mar 2, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy resins have been found to be fortified (increased in strength and modulus yet not made brittle) by compounding: PA0 (a) a resin-forming polyepoxide PA0 (b) an amine curing agent for (a) and PA0 (c) a fortifier for (a)+(b) comprising the reaction product of PA1 (i) an aromatic polyhydroxy compound and PA1 (ii) a diepoxide with one epoxy group less reactive than the other: and heat curing the mixture. Strengths as high as 140 MPa and moduli as high as 4500 MPa have been attained with a ductile mode of failure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.