Method for printed circuit board and/or printed wiring board soldermask testing
US4740247A · kind A · utility
26Cited by
16References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1986 |
| Grant date | Apr 26, 1988 |
| Priority date | — |
| Expiry date | Jun 24, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.