Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US4740657A · kind A · utility
131Cited by
13References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1987 |
| Grant date | Apr 26, 1988 |
| Priority date | — |
| Expiry date | Feb 12, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49194
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.