Thermally insulative and electrically conductive interconnect and process for making same
US4740700A · kind A · utility
84Cited by
7References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1986 |
| Grant date | Apr 26, 1988 |
| Priority date | — |
| Expiry date | Sep 2, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pyroelectric focal plane array useful for thermal imaging applications comprises a detector (10), comprises a reticulated and aluminized pyroelectric chip (12) interfaced with a signal processor chip (14) by thermally insulating bumps (30) coated with a thin conductive layer (38) to form a plurality of thermally insulative and electronically conductive interconnections (16) between detector chips (12) and processor chip (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.