Current-limiting thin film termination for capacitors
US4740863A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 15, 1987 |
| Grant date | Apr 26, 1988 |
| Priority date | — |
| Expiry date | May 15, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A small multilayer capacitor, such as an MLC capacitor, has in one of its end terminations a passivation layer surrounded by nested sputter-coated metallization films to provide a safeguarding feature so that the capacitor will not fail short. A process for providing the terminations at the ends of chips for such small MLC capacitors includes applying at least three nested thin films of metallization at the opposite ends of each chip and over the surface of the chip between the ends, and forming the passivation layer before applying the outer nested films, and finally removing a portion of thin films of metallization material intermediate the ends, to provide an MLC capacitor having proper metallized end terminations. Preferably, the thin films are applied to cover the entire surface of each chip by sputtering thin film material onto a batch of tumbling chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.