Sealed-type liquid cooling device with expandable bellow for semiconductor chips
US4740866A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1986 |
| Grant date | Apr 26, 1988 |
| Priority date | — |
| Expiry date | Mar 25, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.