End terminations for capacitors
US4741077A · kind A · utility
12Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 15, 1987 |
| Grant date | May 3, 1988 |
| Priority date | — |
| Expiry date | May 15, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for providing terminations at the ends of chips for multilayer capacitors such a MLC capacitors includes applying thin films of metallization at the opposite ends of each chip and over the surface of the chip between the ends, and thereafter removing a porton of the thin films of metallization material intermediate the ends, to provide a monolithic multilayer capacitor having proper metallized end terminations. Preferably, the thin films are applied to cover the entire surface of each chip by sputtering thin film material onto a batch of tumbling chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.