Patent · US Expired

Method for positioning and bonding a solid body to a support base

US4741796A · kind A · utility

37Cited by

7References

24Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hans-Ludwig Althaus · Lappersdorf, DE
Werner Kuhlmann · Stephanskirchen, DE
Werner Spaeth · Holzkirchen, DE

Key dates

Filing date	Apr 24, 1986
Grant date	May 3, 1988
Priority date	—
Expiry date	Apr 24, 2006

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1089
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained from positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.