Process and apparatus for electrolytically depositing in a moving mode a continuous film of nickel on metal wire for electrical use
US4741811A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1987 |
| Grant date | May 3, 1988 |
| Priority date | — |
| Expiry date | Feb 27, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/0607
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a process and an apparatus for electrolytically depositing, in a moving mode, a continuous film of nickel on metal wire for electrical use. The process comprises using an activation bath and a nickel-plating bath in which the current density is reduced in the upstream portion of the nickel plating bath and/or the downstream portion of the activation bath and the acidity of the nickel-plating bath is so regulated as to develop the nickel in the form of strongly adhering globules of small diameter, which completely cover the wire. The reduction in the above mentioned current density and control in respect of the current density profile along the bath may be achieved by acting on the position of the electrodes in the bath and/or by interposing screens between the electrodes and the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.