Patent · US Expired

Method for manufacturing thermally stabilized plastic film capacitor

US4741876A · kind A · utility

7Cited by
9References
5Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 26, 1985
Grant dateMay 3, 1988
Priority date
Expiry dateMar 26, 2005

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01G4/30
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method for processing a layered structure incorporating alternating plastic film and electrically conductive layers to enhance thermal and capacitive stability of the structure, which plastic film has molecular bonds oriented in a first axis and a second axis, the method comprising the steps of applying compressive force to the structure in a third axis, which third axis is substantially perpendicular to the first and second axes; and raising the structure from an ambient temperature to a processing temperature while maintaining the compressive force on the structure, the processing temperature being sufficiently high to randomize the molecular bonds; and maintaining the structure at the processing temperature and under the compressive force for a processing time sufficient to effect randomization of substantially all of the molecular bonds in the structure; and allowing the structure to substantially cool to ambient temperature before removing the compressive force from the structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.