Patent · US Expired

Thin-film circuit and method of making the same

US4742325A · kind A · utility

5Cited by
3References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 20, 1987
Grant dateMay 3, 1988
Priority date
Expiry dateFeb 20, 2007

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/30105
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A thin-film circuit including integrated resistors and conductors. The conductors consist of two superposed Au layers having a Pd layer sandwiched between them. The conductors have a sheet resistivity of R 10 m and are solderable and bondable. The thin-film circuit is suitable for applications in the GHz range.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.