Thin-film circuit and method of making the same
US4742325A · kind A · utility
5Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 1987 |
| Grant date | May 3, 1988 |
| Priority date | — |
| Expiry date | Feb 20, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin-film circuit including integrated resistors and conductors. The conductors consist of two superposed Au layers having a Pd layer sandwiched between them. The conductors have a sheet resistivity of R 10 m and are solderable and bondable. The thin-film circuit is suitable for applications in the GHz range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.